Chipanalog Analog ICs on ICGOODFIND SiteMap
最新文章
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- China’s Largest Automotive Chip Test Center Launches in Shanghai Lingang
- Micron and Anthropic Forge AI Infrastructure Partnership Across HBM, DRAM, and Equity
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- Intel and AMD Unite on ACE AI Compute Extension, Boosting x86 AI Performance Up to 16x
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- NXP’s SAF8444 Single‑Chip Radar Brings ADAS to Entry‑Level EVs
- Li Auto’s Mach M100 Dataflow Chip Hits 1280 TOPS, Outperforms Nvidia ThorU
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- TSMC 3nm Capacity Hits 175K Wafers/Month Yet Still Tight, H2 Price Hike Up to 15%
- AWS Launches Graviton5: 3nm, 192 Cores, DDR5‑8800, PCIe Gen 6 – First 3nm Cloud Arm CPU
- Jiangbolong VP Files for $31M Stock Sale After 840% Rally – Second Stake Reduction
- China GPU ‘Four Dragons’ Member Enflame Nears STAR Market IPO Hearing, Targets $825M Raise
- Shenzhen Huaqiang Confirms Price Hikes on Some HiSilicon Chips, Sees Broad Component Upturn
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- Shenzhen University Launches Integrated Circuit School to Boost Chip Talent Pipeline
- Broadcom Q2 Net Income Soars 87.5% to $9.31B, AI Revenue Up 143%
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Synopsys Rolls Out TSMC N6C/N4C IP Portfolio for Cost‑Optimized AI Chips
- NXP ASC8850ET: A Comprehensive Technical Overview and Application Guide
- NXP PDTA143ET,215: A Comprehensive Technical Overview of the Digital PNP Transistor
- NXP 74HC14DB: A Comprehensive Guide to the Hex Inverting Schmitt Trigger IC
- NXP BCP52,135: A Comprehensive Technical Overview and Application Guide
- NXP BUK7M17-80EX: A High-Performance Automotive MOSFET for Demanding Applications
- NXP BUK9635-55A: A Comprehensive Technical Overview of the 55V Logic Level MOSFET
- NXP BT139-800: A Comprehensive Technical Overview of the 800V Standard Triac
- Qualcomm Rolls Out IQ10 Robot Reference Design with up to 700 TOPS for Industrial and Humanoid Bots
- NXP BGU8103X: A High-Performance GPS Low-Noise Amplifier for Advanced RF Applications
- Nvidia N1 Series Arm SoC Specs Leak: N1X and N1 Chips for PC Platform
- Samsung Delivers Industry’s First 12‑Stack HBM4E Samples: 48GB, 3.6TB/s
- ChangXin Memory IPO Clears STAR Market Review, Plans $4.1B Raise
- Kingboard Laminate Raises PCB Material Prices by up to 20% as Raw Material Costs Bite
- NXP PCA9617ATPZ: A High-Performance Differential I2C Bus Repeater for Signal Integrity Extension
- NXP UJA1162ATK: A Comprehensive System Basis Chip for Automotive Networking Applications
- NXP 74LVC1G66GW: A Comprehensive Guide to the Single-Pole Single-Throw Analog Switch
- NXP PCA9515AD,118: A Comprehensive Technical Overview and Application Guide for the I²C Bus Repeater
- NXP PCA9500PW,118: I2C Bus Repeater with Level Shifting for Enhanced System Design and Signal Integrity
- NXP PCH7900NTT/C0K: A Comprehensive Overview of its Architecture and Automotive Applications
- NXP P89LPC954FA: An In-Depth Technical Overview of the 8-bit Microcontroller
- The NXP TJA1054: A Comprehensive Guide to the Advanced High-Speed CAN Transceiver
- Domestic MEMS Chip‑Level Fan Cools CPU with Near‑Zero Noise – China’s Thermal Breakthrough
- Samsung’s Non‑Chip Workers Seek Court Order Over Vast Pay Gap vs Semiconductor Staff
- Unigroup Guoxin Buys Raynen Semiconductor for $263M to Boost Power Semi IDM
- TSMC Targets Panel‑Level Packaging with CoPoS Platform, Mass Production by 2028
- US FTC Launches Antitrust Probe into Arm Over Licensing Practices
- Power Management IC Prices Rise as Foundry, Assembly Costs Bite – PMIC Makers Set for H2 Upside
- NXP BUK9226-75A: A High-Performance Automotive Power MOSFET for Advanced Switching Applications
- NXP PDZ18B: A Comprehensive Technical Overview of its Zener Diode Characteristics and Circuit Protection Applications
- The NXP MK21FN1M0AVMC12: A High-Performance ARM Cortex-M4 Microcontroller for Demanding Embedded Applications
- NXP 74HC595DB: An In-Depth Look at the 8-Bit Serial-In, Parallel-Out Shift Register
- NXP BZX84-C27: A Comprehensive Technical Overview of the 7V Zener Diode
- NXP 74LVC162244ADGG: 16-Bit Buffer/Line Driver with 5V Tolerant Inputs/Outputs and 3-State Outputs
- SMIC Q1 Revenue Hits Record $2.505B, Guides 14–16% Growth in Q2
- NXP FX32K144UAT0VLLT: A Comprehensive Technical Overview of the 32-bit Automotive Microcontroller
- NXP QN9020/D: A Comprehensive Overview of its Ultra-Low-Power Bluetooth Low Energy SoC Architecture and Applications
- Tencent to Boost Domestic AI Chip Usage in H2 2026, Scaling Huawei Ascend and More
- ams OSRAM Sells CMOS Image Sensor Business to indie Semiconductor for €40M
- US Reveals $2.5B Nvidia GPU Smuggling Ring: Bangkok’s OBON Named as ‘Company-1’
- NXP PMEG2005CT: A Comprehensive Analysis of the 20V, 5A Dual Schottky Barrier Rectifier
- NXP PESD15VL1BA: Ultra-Low Capacitance ESD Protection Diode for High-Speed Data Lines
- The NXP 74HC273N: A Detailed Look at the Octal D-Type Flip-Flop with Reset
- NXP 74LVC1G11GW: A Single 3-Input AND Gate for High-Performance, Low-Voltage Digital Design
- NXP MKL15Z128VFT4: A Comprehensive Technical Overview of the ARM Cortex-M0+ Based Microcontroller
- NXP UJA1169ATK: A Comprehensive System Basis Chip for Next-Generation Automotive Networks
- NXP NQ310A1EV/C101: A Comprehensive Overview of the Secure Authentication IC
- NXP MKE02Z32VLC4: A Comprehensive Technical Overview of the Entry-Level ARM Cortex-M0+ Based Microcontroller
- Sunlord’s AI Inductors Enter Mass Production, Tantalum Caps Ramp Up in eSSD and Data Centers
- Murata to Invest ¥80 Billion in MLCC Expansion, Targets Data Center Demand
- India Approves Two New Semiconductor Projects – Enters GaN Foundry Race
- Apple Courts Intel & Samsung for Chip Foundry as Samsung Hits $1 Trillion
- NXP MIMXRT1052CVL5B: A High-Performance Crossover Microcontroller for Next-Generation Embedded Applications
- NXP MC34PF3000A1EPR2: A Comprehensive Overview of its Features and Applications
- NXP PCA8574APW: A Comprehensive Guide to the Remote 8-Bit I/O Expander for I2C Bus
- NXP BFQ67W: High-Performance NPN Wideband Transistor for RF Amplification Applications
- NXP PTVS5V0P1UP: The Ultimate ESD Protection Diode for High-Speed Data Lines
- NXP BZX84-B2V4: A Detailed Overview of the 4V Zener Diode
- PCF2131TFY: NXP's Ultra-Low-Power Real-Time Clock with Integrated Crystal and Temperature Compensation
- NXP PESD3V3U1UB: Ultra-Low Capacitance ESD Protection Diode for High-Speed Data Lines
- Xiamen Silan Jihua Gets 1,944% Capital Injection – $700M for 12‑Inch Analog Fab
- NXP Q1 Revenue Rises 12%, Net Profit Doubles – Auto & Industrial Rebound
- Tri-Circuit’s 1μm MLCC Breakthrough – $9B Revenue Hides a High-End Secret
- VeriSilicon’s Orders Explode to $4.5B – AI ASIC Drives 85% of New Deals
- China IC Fund Cuts Stake in Techbond – Third Sale in 12 Months
- Microchip dsPIC33FJ64GP204T-I/ML Digital Signal Controller
- Microchip PIC24FJ64GB004-I/ML: A Comprehensive Technical Overview and Application Guide
- Microchip PIC24FJ64GA705-I/PT: A Comprehensive Technical Overview and Application Guide
- Microchip PIC24FJ64GA010-I/PT 16-bit Microcontroller Overview and Application Guide
- Microchip PIC24FJ512GU410-I/PT: A Comprehensive Technical Overview
- Digital Signal Controller: Microchip dsPIC33FJ32MC302-I/SO for Advanced Motor Control and Digital Power Conversion
- Microchip dsPIC33FJ32GS606-I/MR Digital Signal Controller for Advanced Digital Power Conversion and Motor Control Applications
- Digital Signal Controllers: Harnessing the Power of the DSPIC33FJ64GP710-I/PF Microchip
- 8-Inch Wafer Foundry Price Hikes Spread – DB HiTek, SMIC, UMC, PSMC, Vanguard All In
- Revenue Hits $1.12B – Xinlian Integration Stays China‘s #1 MEMS Foundry
- Unisoc IPO Gains Speed – Poised to Become China’s First Smartphone Chip Stock
- TSMC’s CC Wei Unveils Advanced Packaging Edge, CoWoS Monthly Capacity to Hit 170,000 Wafers by 2027
- China’s First RISC-V+AI+Post-Quantum Automotive MCU Chip Debuts – CCRC4XXX Series
- Apple Supplier Rejects Additional iPhone 18 Pro Lens Orders – Rare Move Shakes Supply Chain
- Actions Microelectronics 2025 Net Profit Surges 91.95%, Edge AI Becomes Key Growth Driver
- Allwinner Q1 Net Profit Soars Over 238% on Strong Demand